Suitable for Hitachi KM11 oil pressure sensor EX200-2-3-5
Product introduction
Four pressure technologies of pressure sensor
1. Capacitive
capacitive pressure sensors are usually favored by a large number of OEM professional applications. Detecting capacitance changes between two surfaces enables these sensors to sense extremely low pressure and vacuum levels. In our typical sensor configuration, a compact housing consists of two closely spaced, parallel and electrically isolated metal surfaces, one of which is essentially a diaphragm that can bend slightly under pressure. These firmly fixed surfaces (or plates) are mounted so that the bending of the assembly changes the gap between them (actually forming a variable capacitor). The resulting change is detected by a sensitive linear comparator circuit with (or ASIC), which amplifies and outputs a proportional high-level signal.
2.CVD type
chemical vapor deposition (or "CVD") manufacturing method bonds polysilicon layer to stainless steel diaphragm at molecular level, thus producing sensor with excellent long-term drift performance. Common batch processing semiconductor manufacturing methods are used to create polysilicon strain gauge bridges with excellent performance at a very reasonable price. CVD structure has excellent cost performance and is the most popular sensor in OEM applications.
3. Sputtering film type
Sputtering film deposition (or "film") can create a sensor with maximum combined linearity, hysteresis and repeatability. The accuracy can be as high as 0.08% of full scale, while the long-term drift is as low as 0.06% of full scale every year. Extraordinary performance of key instruments-our sputtered thin film sensor is a treasure in the pressure sensing industry.
4.MMS type
These sensors use micro-machined silicon (MMS) diaphragm to detect pressure changes. The silicon diaphragm is isolated from the medium by the oil-filled 316SS, and they react in series with the process fluid pressure. MMS sensor adopts common semiconductor manufacturing technology, which can achieve high voltage resistance, good linearity, excellent thermal shock performance and stability in a compact sensor package.