Fuel pressure sensor for Cadillac Buick Chevrolet 13500745

This design and production process of pressure sensor is actually the practical application of MEMS technology (the abbreviation of microelectromechanicalsystems, that is, micro-electromechanical system).

MEMS is a 21st century frontier technology based on micro/nanotechnology, which enables it to design, process, manufacture and control micro/nano materials. It can integrate mechanical components, optical systems, driving components, electronic control systems and digital processing systems into a micro-system as a whole unit. This MEMS can not only collect, process and send information or instructions, but also take actions autonomously or according to external instructions according to the obtained information. It uses the manufacturing process combining microelectronics technology and micromachining technology (including silicon micromachining, silicon surface micromachining, LIGA and wafer bonding, etc.) to manufacture various sensors, actuators, drivers and microsystems with excellent performance and low price. MEMS emphasizes the use of advanced technology to realize micro-systems and highlights the ability of integrated systems.

Pressure sensor is a typical representative of MEMS technology, and another commonly used MEMS technology is MEMS gyroscope. At present, several major EMS system suppliers, such as BOSCH, DENSO, CONTI and so on, all have their own dedicated chips with similar structures. Advantages: high integration, small sensor size, small connector sensor size with small size, easy to arrange and install. The pressure chip inside the sensor is completely encapsulated in silica gel, which has the functions of corrosion resistance and vibration resistance, and greatly improves the service life of the sensor. Large-scale mass production has low cost, high yield and excellent performance.

In addition, some manufacturers of intake pressure sensors use general pressure chips, and then integrate peripheral circuits such as pressure chips, EMC protection circuits and PIN pins of connectors through PCR boards. As shown in Figure 3, the pressure chips are installed on the back of the PCB board, and the PCB is a double-sided PCB board.

This kind of pressure sensor has low integration and high material cost. There is no fully sealed package on PCB, and the parts are integrated on PCB by traditional soldering process, which leads to the risk of virtual soldering. In the environment of high vibration, high temperature and high humidity, PCB should be protected, which has high quality risk.